Next year’s iPhone 14 could be the first smartphone to use TSMC’s new packaging platform
TSMC’s new 3DFabric packaging platform could debut on iPhone 14
Diagrams show a typical SoC (A) followed by SoIC using chips (B, C, D)
As a result, it’s not clear whether we’ll see the 3DFabric packaging platform used in the iPhone 14, although Patently Apple’s report states that “Apple’s next-gen iPhones in 2022 will likely use the iPhone 14. TSMC’s 3D Fabric platform “. The report adds that with the platform, many AI functions, new types of memory and integrated chips will be combined. TSMC is expected to test the platform this year at its Zhunan and Nanke facilities with mass production slated for the second half of 2022.
TSMC’s new packaging platform takes a Lego-like modular approach using chiplets
If that sounds like some sort of modular package solution, it is. In a video TSMC produced to show off the new platform, kids play with Lego blocks, the ultimate modular toy. Liao Dedui, deputy general manager of advanced packaging technology and services at TSMC, said the 3DFabric brings together advanced packaging and testing technologies.
Apple has apparently decided to spend the money on improving graphics performance instead of the processor. The company has seen some of its top chip developers leave Apple, which could explain the disappointing year-over-year processor improvements. While Apple generally likes to compare new components with those used on models from the previous year, this year comparisons have been made “against the competition” and these companies (such as Samsung and Qualcomm) will not ship. not their next-gen chips until we approach the end of the year.