High-performance COM-HPC carrier board in Micro-ATX form factor
27-07-2022 | Congatec | Submarines and systems
congatec has entered the high-end industrial workstation and desktop client market by launching its first Micro-ATX compatible modular carrier board with COM-HPC interface. The board is designed for long-term embedded availability of at least seven years, eliminating the design risks, revision requests, and supply chain uncertainties of standard or semi-industrial motherboards that are not often only available for three to five years. As it is processor socket and vendor independent, the board can be fitted with any high-end CoM available in COM-HPC A, B, or C customer sizes, making designs Even more flexible and durable OEM. Impressive scalability on the full line of 12th Gen Intel Core processor-based COM-HPC modules, which it provides in 14 different flavors of high-end performance, is just the beginning of the possibilities.
Performance options for the new line of conga-HPC/uATX carrier boards range from conga-HPC/cALS COM-HPC Client Size C modules, offering the highest on-board client performance with the current 16-core Intel Core i9 processor, price/performance optimization masters – conga-HPC/cALP COM-HPC Size A client modules with Intel Celeron 7305E processor.
The combination of ready-to-use industrial-grade COM and carrier boards with bespoke cooling solutions and comprehensive BSPs for all major RTOS and Real-Time Systems real-time hypervisor is ideal for the fastest time to market, produces non-recurring engineering costs, enables customers to respond quickly to changing market demands, and minimizes efforts to scale performance of Micro-ATX-based systems. It allows customers to build a complete product portfolio based on a single carrier concept.
Future upgrade and update options for Micro-ATX-based platforms are inherent in the design, providing maximum performance flexibility, system design security, and long-term sustainable availability for designs application-specific custom carrier boards and systems. In times of supply chain uncertainty, the ability to select any available COM-HPC module is a particular advantage. OEMs benefit from not being tied to a particular BGA or LGA processor from a single silicon or computer-on-module vendor, greatly reducing the risk of supply shortages. At the same time, application-specific mechanics and peripherals can remain as-is with no hardware modifications required.
“The new industrial-grade COM-HPC carrier board in Micro-ATX form factor brings all the benefits of computer-on-modules to the high-end industrial and semi-industrial motherboard market. It will evolve conventional system designs based on motherboards suitable for a certain generation of processors to much more flexible and sustainably scalable motherboard configurations that use computers-on-modules. Industrial applications need life cycles longer than three to five years to reduce NRE costs and maximize the return on investment of dedicated systems. Being able to switch processor performance to any future option without having to rebuild the whole system is therefore a huge advantage for many industries,” says Martin Danzer, Director of Product Management, congatec.
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